IR Scene Projector (IRSP) Engineering Program Manager

IR Scene Projector (IRSP) Engineering Program Manager
Micross Components, United States

Experience
1 Year
Salary
0 - 0
Job Type
Job Shift
Job Category
Traveling
No
Career Level
Telecommute
No
Qualification
Bachelor's Degree
Total Vacancies
1 Job
Posted on
Feb 17, 2024
Last Date
Mar 17, 2024
Location(s)

Job Description

The primary role is a Program Management and Engineering role. The Program Management aspect of the position requires the successful candidate to manage the IR Scene Projector (IRSP) program area, including quoting projects, setting up project schedules, managing projects to budget and schedule, directing the IR Scene Projector team members on daily and weekly program priorities, and being the primary point of contact for customer communication. The Engineering aspect of the position requires the successful candidate to learn and support key wafer processing and inspection steps to further develop and fabricate IR emitter pixels. Wafer processing tasks may include sputter depositions, reactive sputter depositions, ion milling, plasma etching, ultrasonic (US) resist strips, microscope inspections, and thin film metrology. The successful candidate will need to develop an understanding of all IR emitter pixel relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). A secondary goal is to become familiar with the post wafer processing flows required to integrate and package IR emitter arrays on Si interposers, carriers, and coolers. This position will manage and support both externally and internally funded (IRamp;D) projects.

  • Daily tactical management of process development activities across multiple projects with a team of senior-level engineers.
  • Program Management of IRSP program area, including project quoting, setting project schedules, managing projects to budget and schedule, and setting program team priorities.
  • Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers.
  • Prepare project status reports (emails, PowerPoint slide decks, and/or Word documents), lead weekly customer meetings and customer communications.
  • Employ standard troubleshooting protocols.

SPECIAL SKILLS AND EXPERIENCE REQUIRED

  • Excellent hands-on laboratory skills
  • Capable of collecting and analyzing data
  • Proficient in Microsoft Office, including MS Project or similar
  • Generation of reports for customer communication
  • Excellent written and verbal communication skills
  • Possess strong analytical skills.

Requirements

  • US citizenship or permanent resident alien status is required.
  • B.S., M.S., or Ph.D. in physical science or engineering with wafer processing experience
  • Program or project management experience, including use of Gantt charts and budget management
  • Hands-on experience in wafer processing and basic semiconductor device processing, with a good background in thin film deposition, dry/wet etch, or photolithography.
  • Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a must.
  • The ideal candidate should have project management skills in an Ramp;D environment with the ability to optimize processes to a mature manufacturing state, along with appropriate QA checks and measures

Job Specification

Job Rewards and Benefits

Micross Components

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