Engineer - Fab Engineering
Samsung, United States
Job Description
Position Summary
Samsung Austin Semiconductor is one of the most advanced semiconductor manufacturing facilities in the world with more than 3,000 employees and 2.45 million square feet of floor space. Samsung Austin Semiconductor has broad semiconductor process technology offerings serving customers in various application areas including mobile, consumer, networking/high performance computing, Internet of Things, RF and automotive. Since 1996, SAS has invested approximately $17 billion in its Austin, TX campus, making it one of the largest direct foreign investments in United States history. Samsung Austin Semiconductor is a US-based subsidiary of Samsung Electronics Co., Ltd. The Austin facility is one of the few semiconductor plants the company has outside South Korea. Visit www.samsung.com/us/sas.
SAS is focused on being the World’s Best Foundry product supplier.
Engineer roles are open for the following Fab Engineering departments:
• Cleans
• CVD
• Diffusion
• Etch
• Metrology
• Photolithography
Role and Responsibilities
Identifies new assignments/projects that should be worked on.
Provides guidance to personnel and management on technical projects, incidents or changes.
Provides guidance to non-exempt and exempt personnel, and may serve in a supervisory capacity in a “team representative role” (i.e., lead).
Works on complex assignments that require an in-depth evaluation of various factors.
Understands implications of work and makes recommendations for solutions.
Must have expert understanding of equipment/processes in assigned areas and should be capable of shifting focus of individual/group’s goals once priorities change.
Continuously adds to and revises Standard Operating Procedures (SOPs).
Manages more complex projects (may be cross functional) generally between 6-12 months.
Generally works a broad number of technical employees and is able to influence the area’s members to enable technical decisions; may lead area projects.
Drive improvement within a single function.
Proficiently utilizes tools and owns broader KPIs not limited to one tool / PRC / layer / material.
Plans and prioritizes work for other team members.
Leads and directs relevant maintenance / improvements plan and actions
Participates and provides guidance to relevant daily issues / daily resolutions / daily actions.
Defines, proposes, and drives implementation areas of improvement within the department as well as other related areas for more complex processes.
Manages data collection, disposition and actions for YCC, TFT etc.
Owns 8D actions and root cause findings.
Leads intra-department collaboration to resolve complex issues through TFTs and ongoing technical meetings.
Applies data science tools to find root cause.
Uses DOE approach properly.
Oversees all aspects of hardware installation.
Creates the budget for capital spending and spare parts spending.
Recommends large scale improvement projects.
Trains and mentors junior engineers on duties and projects.
Works on projects with a broad departmental scope, has many undefined components, have impact across the department and has many interdependencies.
Regular attendance and timeliness is required per departmental guidelines
Communicates technical information to executive leadership outside of the department.
Job Specification
Skills and Qualifications
Bachelor's of Science degree in Chemical, Mechanical, Industrial or Electrical Engineering, Computer Science, Mathematics, Chemistry, Physics or a related field.
4 – 10 year’s experience.
Possesses deep knowledge in area of ownership and the integration in the overall semiconductor manufacturing process.
Able to interpret failure analysis, complex yield signals and data science correlations.
Communicates technical information to executive leadership outside of the department.
Has effective meeting management skills.
Provides technical leadership within the team.